DNA切除修复与转录偶联
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DNA Excision Repair and Coupling Transcription
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    摘要:

    细胞DNA受到某些环境理化因子损伤后,其中活性转录基因和DNA转录链上的损伤被优先切除修复,这种DNA选择性修复直接与基因转录过程偶联.在大肠杆菌中已分离到实现此功能的转录修复偶联因子(TRCF),是由mdf基因编码的一种具有ATPase活性的DNA结合蛋白.在真核细胞中,发现某些DNA修复蛋白也在DNA转录中起作用,如人DNA切除修复基因ERCG-3编码产物,是转录因子TFⅡH中最大亚基p89,酵母切除修复基因RAD3就是编码因子b的最大亚基p85.

    Abstract:

    With DNA lesions induced by environmental physical and chemical factors, actively transcribed genes and DNA transcribed strands were preferentially repaired.This preferential DNA repair directly connected with the process of gene transcription.A transcription-repair coupling factor (TRCF) encoded by mdf gene has been identified and isolated in E. coli. TRCF is a DNA binding protein with ATPase activity. In eukaryotes, some DNA repair proteins were found to be involved in transcription. For example, the largest subunit of general transcription factor TFⅡH, p89, is the encoding product of human excision repair gene ERCC-3 .And the excision repair gene RAD3 of yeast encodes the largest subunit of transcription factor b, p85.

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周平坤. DNA切除修复与转录偶联[J].生物化学与生物物理进展,1996,23(2):141-145

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  • 收稿日期:1995-05-15
  • 最后修改日期:1995-08-28
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